Carsem is a leading provider of turnkey packaging and test services

   to the semiconductor industry, and offers one of the largest package and test

   portfolios in the world. Founded in 1972, Carsem is among the most experienced

   companies in the industry and it is recognized as one of the largest in unit

   volume production. The company has over 9,000 employees and assembles in excess

   of 100 million units each week, more than 65 percent of this volume is fully

   electrically tested product. Carsem is a member of one of Southeast Asia042s most

   successful and respected corporations, the Hong Leong Group, where

   semiconductors assembly and test has been considered a core business for over

   25 years.

    The company has three high-technology factories:

    Two factories are located in Ipoh, Malaysia, a 90-minute drive from

   Penang, 2 hours from Kuala Lumpur and has daily flights to Singapore. The

   factories are supported by extensive R&D and failure analysis staff who

   incorporate highly sophisticated, "state-of-the-art" equipment to

   ensure that the quality of our products meet the exacting standards required by

   the automotive, telecom, computer, and consumer electronics industries.

    The China factory, Carsem-Suzhou, Ltd. Which is located in the

   province of Jiangsu, 50 miles west of Shanghai, started production in 2004. The

   factory is focused on assembly & test for the MLP-Micro Leadframe Package

   (QFN Format) and has shipped over 4 billion units worldwide. Carsem-Suzhou

   offers the identical materials, process and quality standards as the Malaysian

   factories.

    Carsem042s portfolio is at the leading edge of packaging & test

   technology and is a world leader in the manufacture of the MLP package with

   over 12 billion units shipped world-wide. The recently introduced ultra small

   X3 MLP package is the equivalent of the 0201 outline and represents the

   industries042 smallest MLP production package. Carsem042s SiP (System-in-Package)

   solution incorporates multiple die and/or passive components assembled in

   leadframe based format. Carsem042s advanced process solutions include, Flip-Chip

   on Leadframe (FCOL), Chip on Lead (COL) & Copper Clip/Strap technologies.

   These three process solutions are offered in the complete range of Carsem042s packages.

    All Carsem factories maintain world-class quality standards, having

   achieved ISO/TS 16949, ISO-9001, ISO-14001, ANSI/ESD S20.20 certifications and

   comply with the Sony Green Partner Program.